Intel's 3D chip tech is 'perfect' so it doesn't have to follow AMD's chiplet design | PC Gamer - carlsongerfulty
Intel's 3D chip technical school is 'perfect' so it doesn't have to accompany AMD's chiplet aim
Intel's new CEO, Pat Gelsinger, says its 3D packaging technology is "perfect" and that gives IT "the ability to not atomic number 4 doing chiplets, but to be doing tiles." AMD uses TSMC's chiplet packaging technology to build affordable, high pressure core-count CPUs, but Gelsinger is suggesting that because its stacking conception is so righteous Intel doesn't undergo to go cut down that traveling and crapper use a to a greater extent performant tile stacking attack.
In the Intel Unleashed event last night the Q&A;A section at the end of the outcome highlighted the difference between Intel's Tile design and AMD's Chiplet model. Thanks to its advanced promotion technical school, Intel is suggesting that a modular stacked approach is better than AMD's chiplet design.
One of the cock-a-hoop differences between these two is how the individual elements pass along with each other. With AMD's chiplet design, inter-chip communicating is fast, but going from one chiplet to other requires a bus, whereas that's not the case with Intel's tile design.
"One of the cool things that I found when I came rachis was that, flatbottomed though there were around issues in the outgrowth technology, the 3D packaging technology, [chef's kiss] perfect," says Gelsinger. "Uncontroversial leadership. And this gives USA the ability to not atomic number 4 doing chiplets, but to be doing tiles. Because of that packaging engineering science, we put on't have to buffer interlink, it's actually similar a long wire on-chip.
"And that packaging engineering is part with of what gives us a truly cool reward in the next-generation of our process roadmap where we'atomic number 75 going to be able to mix and match tiles from different process technologies but bring them together as if they'Re one unvarying chip. We'll equal self-propelling from system-on-chip to system-on-package."
As part of the presentation, Tap Gelsinger showed off Ponte Vecchio, Intel's XPU for Exascale Computing and AI. Not a chip that's going to end upfield in our gaming PCs, but interesting because it is a working example of Intel's tile design—constructed knocked out of zero less than 47 tiles, and rolling in at over 100 billion transistors.
So, Intel's technology whole caboodle and does so using a range of various modules. This is thanks to both the Foveros 3D packaging tech and EMIB—which was once accustomed squeeze an AMD GPU onto a package alongside an Intel CPU with Kaby Lake-G, remember that?
Intel may have stumbled with its process technology, but IT's still got wad of tech cognise-how up its sleeve, and this could well lead to IT regaining its butt against in the commercialise. As it is, existence able to produce its own chips way that it isn't suffering the shortages that AMD and Nvidia are. And that, ultimately, means that it's making money where those two lav't.
Alan has been writing about PC tech since before 3D graphics cards existed, and still vividly recalls having to fight with MS-Disk operating system just to get games to onus. He fondly remembers the killer combo of a Matrox Millenium and 3dfx Voodoo, and seeing Lara Croft in 3D for the first time. He's very gladiolus hardware has high as much as it has though, and is specially happy when putting the latest M.2 NVMe SSDs, AMD processors, and laptops through their paces. He has a long-lasting Wizardly: The Gathering compulsion but limits this to MTG Arena these days.
Source: https://www.pcgamer.com/intels-3d-chip-tech-is-perfect-so-it-doesnt-have-to-follow-amds-chiplet-design/
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